SIM2 Series: High Voltage 3-phase Motor Driver
with a ≥40％ Smaller Volume than Conventional


≥40％ Smaller Volume than Conventional

The SIM2 series is a high voltage 3-phase motor driver in which transistors, pre-drive circuits, and bootstrap circuits (diodes and resistors) are highly integrated.
The new product comes in a compact DIP40 package and will best suit compressor-driven applications such as refrigerators and air conditioners.

Along with the lower-loss power elements, we successfully reduced the product’s mold volume by 40% or more compared to our conventional package through a direct bonding copper (DBC) structure—whose excellent heat dissipation is a promising feature. The SIM2 series also achieves the industry’s smallest size* among high-voltage motor driver ICs rated for 15 A to 20 A. The product is available in the package with not only a decreased volume size but also the heat dissipation equivalent of the conventional package.

We have currently been developing a device that can support 30 A with the same package.

* Based on our survey as of January 20, 2023.

Features

  • Sufficient insulation distance:
    　Clearance: 2.788 mm (min.)
    　Creepage: 4.334 mm (min.)
  • Pb-free (RoHS compliant)
  • Isolation voltage: 2000 V (for 1 min), UL-recognized (File No. E118037)
  • Temperature sensing function
  • Built-in bootstrap diodes with current limiting resistors (250 Ω)
  • CMOS-compatible input (3.3 V or 5 V)
  • Fault signal output at protection activation

Protections

  • Undervoltage Lockout for power supply
    　High-side (UVLO_VB): auto-restart
    　Low-side (UVLO_VCC): auto-restart
  • Overcurrent Protection (OCP): auto-restart
  • Thermal Shutdown (TSD): auto-restart, with an operating range of ±5 °C

Applications

For motor drives such as:
  • Refrigerator compressor motor
  • Air conditioner compressor motor

SIM2 Series Selection Guide

Part Number / Data SheetVCESICOutput TransistorVCE(SAT)(Typ.)Thermal ResistancePackage
SIM2-151AB　600 V15 AFS-IGBT＋FRD1.6 V3.6 ℃/W
DIP40
35.7×14.6×4.2 mm
SIM2-202B　600 V20 AFS-IGBT＋FRD1.7 V3.0 ℃/W



If you need to request samples or have any questions, please feel free to contact us using the form below.




The Industry’s Smallest Size* Attained by Ultra-compact DIP40 Package

Schematic View: DBC Structure

The SIM2 series comes in an ultra-compact DIP40 package.
This package adopts the direct bonding copper (DBC) structure to decrease its size (resin area) to 521 mm2 (35.7 mm x 14.6 mm).
The new product stands out for its package size, ≥40% smaller than that of our conventional IC (the SCM1272MA), and attains the industry’s smallest size*.

* Based on our survey as of January 20, 2023.

Package Guideline for High Voltage Motor Drivers



Enhanced Heat Dissipation

The SIM2 series employs the direct bonding copper (DBC) structure in which components like a chip can be placed directly on a substrate.
This structure allows the product to fit into the compact package yet has smaller thermal resistance, resulting in a thermally enhanced performance.


Ensured Clearance/Creepage

The SIM2 series ensures sufficient insulation distance: a clearance of 2.788 mm (min.) between the high-voltage pins (COM－VB3), and a creepage of 4.334 mm (min.).


Precise Temperature Monitor

The SIM2 series incorporates the temperature sensing function.
This function monitors the junction temperature of the internal control IC using a temperature-sensing voltage that the VT pin outputs.
With a variation of ±1.6% in junction temperature over temperature sensing voltage, the product boasts its preciseness equivalent to that of thermistor-mounted devices.


Thermal Shutdown (TSD)

The SIM2 series has the thermal shutdown (TSD) function.
This function starts to operate when the internal control part exceeds the TSD operating temperature, TDH = 120 °C (typ.).
In addition, the TSD function is precisely designed so that the operating temperature varies within ±5 °C of its typical value.


If you need to request samples or have any questions, please feel free to contact us using the form below.




Questions or Comments?

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