1 Precautions for Device Selection

1.1 Maximum Ratings

1.2 Derating

1.3 Fail Safe Design

1.4 Applications and Usage Environments

1.5 Use in High-reliability Equipment

1.6 Use in Long-life Equipment

1.7 About Product Life Cycles

2 Precautions for Transportation

2.1 Shock

2.2 Stress

2.3 Temperature

2.4 Water Leakage and Condensation

2.5 Transportation in Poor Environments

2.6 Display of Handling Symbols (Care Marks)

3 Precautions for Packing

3.1 Storage Containers

3.2 Change of Storage Containers (Split across Storage Containers)

3.3 Moisture-proof Packing

3.4 Packing Materials

4 Precautions for Storage

4.1 Storage Environment

4.2 Long-term Storage

4.3 Products Packed in Moisture-barrier Materials

4.4 Products Packed in Taping Materials

5 Precautions for Equipment (PCB) Design

5.1 Absolute Maximum Ratings

5.2 Derating

5.3 Life and Failure Rate

5.4 Thermal Design

5.5 Protection Circuits

5.6 Confirmation of Noise and Malfunction

5.7 Precautions for Printed Circuit Boards (Printed Wiring Boards)

5.8 After-coating (Secondary Resin Coating and Thermal Curing)

5.9 Flame Retardance of Resin and Fire-spreading Prevention

5.10 Safety Design and Fail-safe Design

6 Precautions for Acceptance Inspections

6.1 Electrostatic Discharge (ESD)

6.2 Terminal Reverse Breakdown Voltage

6.3 Application of Transient Voltage

6.4 Insertion and Removal into/form Socket

6.5 Selection of Socket

6.6 Overcurrent Limit during Measurement

6.7 Mixing Up of Deteriorated Semiconductor Devices

6.8 Handling of Terminals

6.9 Storage of Inspection Samples

7 Precautions for Mounting Parts

7.1 Processing of Terminals

7.2 Cutting or Bending of Metal Frame

7.3 Mounting on Heatsink

7.4 Methods for Mounting on PCB

7.5 Soldering

7.6 Cleaning

8 Precautions for PCB Testing and Equipment-level Testing

8.1 Breakdown Factors during In-process Inspections

8.2 In-circuit Testing

8.3 Operational Testing and Equipment-level Testing

8.4 Burn-in Process

9 Measures for Electrostatic Discharge (ESD)

9.1 General Precautions

9.2 ESD-proof Measures during Operations

9.3 ESD-proof Measures after Mounting

9.4 Human Body Protection

9.5 ESD Sensitivity Testing Models for Semiconductor Devices

10 Precautions for Disposal of Semiconductor Devices

10.1 Precautions for Disposal of Semiconductor Devices

10.2 Precautions for Reuse of Semiconductor Devices and Storage Containers

11 Other

11.1 Precautions for Handling of Semiconductor Devices

11.2 Precautions for Counterfeit Products